Compatible for lead free process
the TSM HS02-3000 key features are:
| |
Maximizes
efficiency by applying combined IR and hot air
circulation heating method. |
| |
Minimizes unsoldering
defects by turbulent wave method. |
| |
Adopts nozzle plate drive
system to control fill back |
| |
Control function of distance
between 1st and 2nd nozzle |
| |
Maximizes maintenance
efficiency by control angle of hanger rail from
2 to 5 deg. |
|
Contols rail angle, solder
bath up/down, solder bath in/out, and conveyor
width with motors. |
|
Maximizes maintenance
efficiency by opening and closing covers with
cylinders. |
